Browsing by Author Lin, MH
Showing results 1 to 8 of 8
| Issue Date | Title | Author(s) |
| 2005 | Barrier capability of HfN films with various nitrogen concentrations against copper diffusion in CuHf-N/n(+)-p junction diodes | Ou, KL; Chiou, SY; Lin, MH; Hsu, RQ; 機械工程學系; Department of Mechanical Engineering |
| 1-Jan-2005 | Comparative study of polycrystalline Ti, amorphous Ti, and multiamoIrphous Ti as a barrier film for Cu interconnect | Ou, KL; Yu, MS; Hsu, RQ; Lin, MH; 機械工程學系; Department of Mechanical Engineering |
| 1-Feb-2006 | Copper interconnect electromigration behavior in various structures and precise bimodal fitting | Lin, MH; Lin, YL; Chang, KP; Sul, KC; Wang, TH; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 2004 | A dynamic incentive pricing scheme for relaying services in multi-hop cellular networks | Lin, MH; Lo, CC; 資訊管理與財務金融系
註：原資管所+財金所; Department of Information Management and Finance |
| 1-Dec-2005 | Electromigration lifetime improvement of copper interconnect by cap/dielectric interface treatment and geometrical design | Lin, MH; Lin, YL; Chen, JM; Yeh, MS; Chang, KP; Su, KC; Wang, TH; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 2002 | A prepaid service-based charging and billing protocol for Internet services | Lo, CC; Lin, MH; 資訊管理與財務金融系
註：原資管所+財金所; Department of Information Management and Finance |
| 1998 | QoS provisioning in handoff algorithms for wireless LAN | Lo, CC; Lin, MH; 資訊管理與財務金融系
註：原資管所+財金所; Department of Information Management and Finance |
| 2005 | A quality of relay-based incentive pricing scheme for relaying services in multi-hop cellular networks | Lin, MH; Lo, CC; 資訊管理與財務金融系
註：原資管所+財金所; Department of Information Management and Finance |
