瀏覽 的方式： 作者 Chang, Chia-Cheng
顯示 1 到 2 筆資料，總共 2 筆
| 公開日期 | 標題 | 作者 |
| 1-一月-2019 | High Electromigration Lifetimes of Nanotwinned Cu Redistribution Lines | Tseng, I-Hsin; Li, Yu-Jin; Lin, Benson; Chang, Chia-Cheng; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-一月-2019 | Highly (111)-oriented Nanotwinned Cu for High Fatigue Resistance in fan-out wafer-level packaging | Li, Yu-Jin; Theng, Chih-Han; Tseng, I-Hsin; Chen, Chih; Lin, Benson; Chang, Chia-Cheng; 材料科學與工程學系; Department of Materials Science and Engineering |
