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Browsing by Author Chang, Geng-Ming
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Showing results 1 to 4 of 4
Issue Date
Title
Author(s)
1-Jan-2017
Development and Electrical Investigation of Through Glass Via and Through Si Via in 3D Integration
Chang, Geng-Ming
;
Lee, Shih-Wei
;
Chang, Ching-Yun
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-Mar-2017
Fine-Feature Cu/In Interconnect Bonding Using Single Sided Heating and Chip-to-Wafer Bonding Technology
Lee, Shih-Wei
;
Chang, Ching-Yun
;
Chang, Geng-Ming
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-Mar-2017
A Novel Sealing Redistribution Layer Approach for Through-Glass via Fabrication
Lee, Shih-Wei
;
Chang, Geng-Ming
;
Chang, Ching-Yun
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
2016
Single Sided Heating Method for Chip-to-Wafer Bonding with Submicron Cu/In Interconnects
Chang, Ching-Yun
;
Lee, Shih-Wei
;
Chang, Geng-Ming
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
