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Issue DateTitleAuthor(s)
1-May-2005Aplication of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnectionChiu, SY; Wang, YL; Chang, SC; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
2006Behavior of membrane scaling during crossflow filtration in the anaerobic MBR systemYou, HS; Huang, CP; Pan, JR; Chang, SC; 環境工程研究所; Institute of Environmental Engineering
1-Nov-2000Characterization of additive systems for damascene Cu electroplating by the superfilling profile monitorChiu, SY; Shieh, JM; Chang, SC; Lin, KC; Dai, BT; 材料科學與工程學系; Department of Materials Science and Engineering
15-Aug-2002Dependence of luminescence efficiency on dopant concentration and sintering temperature in the erbium-doped Ba0.7Sr0.3TiO3 thin filmsKuo, SY; Chen, CS; Tseng, TY; Chang, SC; Hsieh, WF; 電子工程學系及電子研究所; 光電工程學系; Department of Electronics Engineering and Institute of Electronics; Department of Photonics
1-Sep-2002The effect of plating current densities on self-annealing Behaviors of electroplated copper filmsChang, SC; Shieh, JM; Dai, BT; Feng, MS; Li, YH; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2002Electroplating copper in sub-100 nm gaps by additives with low consumption and diffusion abilityLin, KC; Shieh, JM; Chang, SC; Dai, BT; Chen, CF; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-Dec-1997Enhancement of anaerobic digestion of waste activated sludge by alkaline solubilizationLin, JG; Chang, CN; Chang, SC; 環境工程研究所; Institute of Environmental Engineering
20-Sep-2004Growth and characterization of tungsten carbide nanowires by thermal annealing of sputter-deposited WCx filmsWang, SJ; Chen, CH; Chang, SC; Uang, KM; Juan, CP; Cheng, HC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-2006High-selectivity damascene chemical mechanical polishingChiu, SY; Wang, YL; Liu, CP; Chang, SC; Hwang, GJ; Feng, MS; Chen, CF; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2006Hole states of X-Bi2Sr2CaCu2O8 [X=I, HgI2, and (Py-CH3)(2)HgI4] probed by OK-edge X-ray absorption spectroscopyChen, JM; Chang, SC; Liu, RS; Lee, JM; Park, M; Choy, JH; 電子物理學系; Department of Electrophysics
1-Mar-2003Improving the quality of electroplated copper films by rapid thermal annealingChang, SC; Shieh, JM; Dai, BT; Feng, MS; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering
1-Nov-2002Investigation of carrying agents on microstructure of electroplated Cu filmsShieh, JM; Chang, SC; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
24-Feb-2006Investigation of overpotential and seed thickness on damascene copper electroplatingChen, KW; Wang, YL; Chang, L; Li, FY; Chang, SC; 材料科學與工程學系; Department of Materials Science and Engineering
1-Aug-2002Investigation of superfilling and electrical characteristics in low-impurity-incorporated Cu metallizationShieh, JM; Chang, SC; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2001Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copperChang, SC; Shieh, JM; Lin, KC; Dai, BT; Wang, TC; Chen, CF; Feng, MS; Li, YH; Lu, CP; 材料科學與工程學系; Department of Materials Science and Engineering
1-Nov-2002Investigations of pulse current electrodeposition for damascene copper metalsChang, SC; Shieh, JM; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-Nov-2002Leveling effects of copper electrolytes with hybrid-mode additivesLin, KC; Shieh, JM; Chang, SC; Dai, BT; Chen, CF; Feng, MS; Li, YH; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2006Mechanism for Cu void defect on various electroplated film conditionsFeng, HP; Cheng, MY; Wang, YL; Chang, SC; Wang, YY; Wan, CC; 材料科學與工程學系; Department of Materials Science and Engineering
2002Micro-photoluminescence from V-shape inverted pyramid in HVPE grown GaN filmLee, CK; Chen, YB; Chang, SC; Pan, CL; Wang, SC; 光電工程學系; Department of Photonics
1-Sep-2002Microleveling mechanisms and applications of electropolishing on planarization of copper metallizationChang, SC; Shieh, JM; Huang, CC; Dai, BT; Li, YH; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 1 to 20 of 37  next >