| 公開日期 | 標題 | 作者 |
| 1-五月-2005 | Aplication of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection | Chiu, SY; Wang, YL; Chang, SC; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2006 | Behavior of membrane scaling during crossflow filtration in the anaerobic MBR system | You, HS; Huang, CP; Pan, JR; Chang, SC; 環境工程研究所; Institute of Environmental Engineering |
| 1-十一月-2000 | Characterization of additive systems for damascene Cu electroplating by the superfilling profile monitor | Chiu, SY; Shieh, JM; Chang, SC; Lin, KC; Dai, BT; 材料科學與工程學系; Department of Materials Science and Engineering |
| 15-八月-2002 | Dependence of luminescence efficiency on dopant concentration and sintering temperature in the erbium-doped Ba0.7Sr0.3TiO3 thin films | Kuo, SY; Chen, CS; Tseng, TY; Chang, SC; Hsieh, WF; 電子工程學系及電子研究所; 光電工程學系; Department of Electronics Engineering and Institute of Electronics; Department of Photonics |
| 1-九月-2002 | The effect of plating current densities on self-annealing Behaviors of electroplated copper films | Chang, SC; Shieh, JM; Dai, BT; Feng, MS; Li, YH; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-五月-2002 | Electroplating copper in sub-100 nm gaps by additives with low consumption and diffusion ability | Lin, KC; Shieh, JM; Chang, SC; Dai, BT; Chen, CF; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-十二月-1997 | Enhancement of anaerobic digestion of waste activated sludge by alkaline solubilization | Lin, JG; Chang, CN; Chang, SC; 環境工程研究所; Institute of Environmental Engineering |
| 20-九月-2004 | Growth and characterization of tungsten carbide nanowires by thermal annealing of sputter-deposited WCx films | Wang, SJ; Chen, CH; Chang, SC; Uang, KM; Juan, CP; Cheng, HC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-三月-2006 | High-selectivity damascene chemical mechanical polishing | Chiu, SY; Wang, YL; Liu, CP; Chang, SC; Hwang, GJ; Feng, MS; Chen, CF; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-一月-2006 | Hole states of X-Bi2Sr2CaCu2O8 [X=I, HgI2, and (Py-CH3)(2)HgI4] probed by OK-edge X-ray absorption spectroscopy | Chen, JM; Chang, SC; Liu, RS; Lee, JM; Park, M; Choy, JH; 電子物理學系; Department of Electrophysics |
| 1-三月-2003 | Improving the quality of electroplated copper films by rapid thermal annealing | Chang, SC; Shieh, JM; Dai, BT; Feng, MS; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-十一月-2002 | Investigation of carrying agents on microstructure of electroplated Cu films | Shieh, JM; Chang, SC; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering |
| 24-二月-2006 | Investigation of overpotential and seed thickness on damascene copper electroplating | Chen, KW; Wang, YL; Chang, L; Li, FY; Chang, SC; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-八月-2002 | Investigation of superfilling and electrical characteristics in low-impurity-incorporated Cu metallization | Shieh, JM; Chang, SC; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-五月-2001 | Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copper | Chang, SC; Shieh, JM; Lin, KC; Dai, BT; Wang, TC; Chen, CF; Feng, MS; Li, YH; Lu, CP; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-十一月-2002 | Investigations of pulse current electrodeposition for damascene copper metals | Chang, SC; Shieh, JM; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-十一月-2002 | Leveling effects of copper electrolytes with hybrid-mode additives | Lin, KC; Shieh, JM; Chang, SC; Dai, BT; Chen, CF; Feng, MS; Li, YH; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-三月-2006 | Mechanism for Cu void defect on various electroplated film conditions | Feng, HP; Cheng, MY; Wang, YL; Chang, SC; Wang, YY; Wan, CC; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2002 | Micro-photoluminescence from V-shape inverted pyramid in HVPE grown GaN film | Lee, CK; Chen, YB; Chang, SC; Pan, CL; Wang, SC; 光電工程學系; Department of Photonics |
| 1-九月-2002 | Microleveling mechanisms and applications of electropolishing on planarization of copper metallization | Chang, SC; Shieh, JM; Huang, CC; Dai, BT; Li, YH; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering |
