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Browsing by Author Chang, Tao-Chih

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Showing results 1 to 8 of 8
Issue DateTitleAuthor(s)
1-Jan-20183-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)Shen, Wen-Wei; Lin, Yu-Min; Chen, Shang-Chun; Chang, Hsiang-Hung; Chang, Tao-Chih; Lo, Wei-Chung; Lin, Chien-Chung; Chou, Yung-Fa; Kwai, Ding-Ming; Kao, Ming-Jer; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Copper-to-Copper direct bonding on highly (111) oriented nano-twinned copper in no-vacuum ambientJuang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chang, Tao-Chih; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Dec-2015The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling testLee, Christine Jill; Chen, Wei-Yu; Chou, Tzu-Ting; Lee, Tae-Kyu; Wu, Yew-Chung; Chang, Tao-Chih; Duh, Jenq-Gong; 材料科學與工程學系; Department of Materials Science and Engineering
1-Dec-2011MULTICHANNEL PLANAR MICROELECTRODE ARRAY FOR SOMATIC MAPPING IN RATSShaw, Fu-Zen; Yang, Tsung-Fu; Huang, Chien-Chun; Yeh, Keng-Hung; Chang, Tao-Chih; Leu, Fang-Jun; 友訊交大聯合研發中心; D Link NCTU Joint Res Ctr
1-Jan-2017Process Development and Material Characteristics of TSV-less Interconnection Technology for FOWLPShen, Wen-Wei; Lin, Yu-Min; Chang, Hsiang-Hung; Kuo, Tzu-Ying; Fu, Huan-Chun; Lee, Yuan-Chang; Lee, Shu-Man; Lin, Ang-Ying; Huang, Shin-Yi; Chang, Tao-Chih; Lee, Alvin; Su, Jay; Huang, Baron; Bai, Dongshun; Liu, Xiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2019An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration ApplicationsLin, Yu-Min; Wu, Sheng-Tsai; Wang, Chun-Min; Lee, Chia-Hsin; Huang, Shin-Yi; Lin, Ang-Ying; Chang, Tao-Chih; Lin, Puru Bruce; Ko, Cheng-Ta; Chen, Yu-Hua; Su, Jay; Liu, Xiao; Prenger, Luke; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
1-Jan-2018An RDL-First Fan-out Wafer-level Package for Heterogeneous Integration ApplicationsLin, Yu-Min; Wu, Sheng-Tsai; Shen, Wen-Wei; Huang, Shin-Yi; Kuo, Tzu-Ying; Lin, Ang-Ying; Chang, Tao-Chih; Chang, Hsiang-Hung; Lee, Shu-Man; Lee, Chia-Hsin; Su, Jay; Liu, Xiao; Wu, Qi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Aug-2018Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection TechnologyShen, Wen-Wei; Lin, Yu-Min; Wu, Sheng-Tsai; Lee, Chia-Hsin; Huang, Shin-Yi; Chang, Hsiang-Hung; Chang, Tao-Chih; Chen, Kuan-Neng; 電子工程學系及電子研究所; 國際半導體學院; Department of Electronics Engineering and Institute of Electronics; International College of Semiconductor Technology
Showing results 1 to 8 of 8