Browsing by Author Chao, Shu-Han
Showing results 1 to 3 of 3
| Issue Date | Title | Author(s) |
| 1-Jan-2014 | Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60 mu m-pitch Solder Micro Bump Interconnections | Huang, Yu-Wei; Zhan, Chau-Jie; Juang, Jing-Ye; Lin Yu-Min; Huang, Shin-Yi; Chen, Su-Mei; Fan, Chia-Wen; Cheng, Ren-Shin; Chao, Shu-Han; Hsieh, Wan-Lin; Chen, Chih; Lau, John H.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2014 | Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigration | Lin, Wan-Hsuan; Chao, Shu-Han; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 電機學院; College of Electrical and Computer Engineering |
| 1-Jul-2017 | Photocontrollable Probe Spatiotemporally Induces Neurotoxic Fibrillar Aggregates and Impairs Nucleocytoplasmic Trafficking | He, Ruei-Yu; Chao, Shu-Han; Tsai, Yu-Ju; Lee, Chi-Chang; Yu, Chu-Yi; Gao, Hua-De; Huang, Yung-An; Hwang, Eric; Lee, Hsien-Ming; Huang, Joseph Jen-Tse; 生物資訊及系統生物研究所; 分子醫學與生物工程研究所; Institude of Bioinformatics and Systems Biology; Institute of Molecular Medicine and Bioengineering |
