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Browsing by Author Chin, YL
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Showing results 1 to 4 of 4
Issue Date
Title
Author(s)
1-Dec-2000
Effect of aluminum seed layer on the crystallographic texture and electromigration resistance of physical vapor deposited copper interconnect
Chin, YL
;
Chiou, BS
;
Wu, WF
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-May-2002
Effect of the tantalum barrier layer on the electromigration and stress migration resistance of physical-vapor-deposited copper interconnect
Chin, YL
;
Chiou, BS
;
Wu, WF
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-Dec-2003
Effects of underlayer dielectric on the thermal characteristics and electromigration resistance of copper interconnect
Chin, YL
;
Chiou, BS
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
2001
A fair scheduling algorithm with adaptive compensation in wireless networks
Wang, KC
;
Chin, YL
;
資訊工程學系
;
Department of Computer Science
