瀏覽 的方式： 作者 Chin, YL
顯示 1 到 4 筆資料，總共 4 筆
| 公開日期 | 標題 | 作者 |
| 1-十二月-2000 | Effect of aluminum seed layer on the crystallographic texture and electromigration resistance of physical vapor deposited copper interconnect | Chin, YL; Chiou, BS; Wu, WF; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-五月-2002 | Effect of the tantalum barrier layer on the electromigration and stress migration resistance of physical-vapor-deposited copper interconnect | Chin, YL; Chiou, BS; Wu, WF; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-十二月-2003 | Effects of underlayer dielectric on the thermal characteristics and electromigration resistance of copper interconnect | Chin, YL; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 2001 | A fair scheduling algorithm with adaptive compensation in wireless networks | Wang, KC; Chin, YL; 資訊工程學系; Department of Computer Science |
