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Browsing by Author Chiu, SH

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Showing results 1 to 4 of 4
Issue DateTitleAuthor(s)
15-Oct-2004Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization padsShao, TL; Chen, YH; Chiu, SH; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
2005Electromigration in eutectic SnPb solder bumps with Ni/Cu UBMChiu, SH; Liang, SW; Chen, C; Lin, SS; Chou, CM; Liu, YC; Chen, KH; 材料科學與工程學系; Department of Materials Science and Engineering
9-Jan-2006Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigrationChiu, SH; Shao, TL; Chen, C; Yao, DJ; Hsu, CY; 材料科學與工程學系; Department of Materials Science and Engineering
1-Nov-2004Thermal gradient in solder joints under electrical-current stressingShao, TL; Chiu, SH; Chen, C; Yao, DJ; Hsu, CY; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 1 to 4 of 4