瀏覽 的方式： 作者 Chiu, SH
顯示 1 到 4 筆資料，總共 4 筆
| 公開日期 | 標題 | 作者 |
| 15-十月-2004 | Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization pads | Shao, TL; Chen, YH; Chiu, SH; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2005 | Electromigration in eutectic SnPb solder bumps with Ni/Cu UBM | Chiu, SH; Liang, SW; Chen, C; Lin, SS; Chou, CM; Liu, YC; Chen, KH; 材料科學與工程學系; Department of Materials Science and Engineering |
| 9-一月-2006 | Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration | Chiu, SH; Shao, TL; Chen, C; Yao, DJ; Hsu, CY; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-十一月-2004 | Thermal gradient in solder joints under electrical-current stressing | Shao, TL; Chiu, SH; Chen, C; Yao, DJ; Hsu, CY; 材料科學與工程學系; Department of Materials Science and Engineering |
