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Browsing by Author Chong, Chai Tai
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Issue Date
Title
Author(s)
2006
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
Nah, Jae-Woong
;
Suh, J. O.
;
Tu, K. N.
;
Yoon, Seung Wook
;
Chong, Chai Tai
;
Kripesh, V.
;
Su, B. R.
;
Chen, Chih
;
材料科學與工程學系
;
Department of Materials Science and Engineering
