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Browsing by Author Chu, David T.
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Showing results 1 to 3 of 3
Issue Date
Title
Author(s)
2016
Communication-Formation of Porous Cu3Sn by High-Temperature Current Stressing
Lin, C. K.
;
Chen, Chih
;
Chu, David T.
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-Jan-2016
Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
Lin, Jie-An
;
Lin, Chung-Kuang
;
Liu, Chen-Min
;
Huang, Yi-Sa
;
Chen, Chih
;
Chu, David T.
;
Tu, King-Ning
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-Dec-2017
Growth competition between layer-type and porous-type Cu3Sn in microbumps
Chu, David T.
;
Chu, Yi-Cheng
;
Lin, Jie-An
;
Chen, Yi-Ting
;
Wang, Chun-Chieh
;
Song, Yen-Fang
;
Chiang, Cheng-Cheng
;
Chen, Chih
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
