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Showing results 1 to 11 of 11
Issue DateTitleAuthor(s)
1-Dec-2018Anisotropic grain growth to eliminate bonding interfaces in direct copper-tocopper joints using < 111> -oriented nanotwinned copper filmsChu, Yi-Cheng; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
3-Oct-2017Communication-Growth of <111> Nanotwinned Nickel Films on <111> Nanotwinned Cu SubstratesChu, Yi-Cheng; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Nov-2017Effect of Sn grain orientation and strain distribution in 20-mu m-diameter microbumps on crack formation under thermal cycling testsChu, Yi-Cheng; Chen, Chih; Kao, Nicholas; Jiang, Don Son; 材料科學與工程學系; Department of Materials Science and Engineering
2016Electromigration in microbumps with Cu-Sn intermetallic compoundsChu, Yi-Cheng; Zhan, Chau-Jie; Lin, Han-Wen; Huang, Yu-Wei; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2016Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devicesChen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Dec-2017Growth competition between layer-type and porous-type Cu3Sn in microbumpsChu, David T.; Chu, Yi-Cheng; Lin, Jie-An; Chen, Yi-Ting; Wang, Chun-Chieh; Song, Yen-Fang; Chiang, Cheng-Cheng; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2017Low temperature Cu-Cu direct bonding by (111) oriented nano-twin CuJuang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
2015Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfacesTseng, Chih-Han; Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
2016LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CUChen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
12-May-2015Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned CuLiu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-May-2014Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfacesLiu, Chien-Min; Lin, Han-Wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
Showing results 1 to 11 of 11