Browsing by Author Di Michiel, Marco
Showing results 1 to 3 of 3
| Issue Date | Title | Author(s) |
| 20-Dec-2017 | Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation | Chang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Jan-2016 | Study of Discrete Voids Formation in Flip-Chip Solder Joints due to Electromigration Using In-Situ 3D Laminography and Finite-Element Modeling | Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering |
| 15-Sep-2016 | Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling | Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering |
