| Issue Date | Title | Author(s) |
| 1-Jun-2000 | The effect of substrate surface roughness on the wettability of Sn-Bi solders | Chen, YY; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-Feb-2003 | Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn-Pb solder in flip-chip technology | Huang, CS; Duh, JG; Chen, YM; Wang, JH; 材料科學與工程學系; Department of Materials Science and Engineering |
| 15-Feb-2001 | The influence of washing and calcination condition on urea-derived ceria-yttria-doped tetragonal zirconia powders | Lin, JD; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 15-Feb-2003 | Low temperature sintering and crystallisation behaviour of low loss anorthite-based glass-ceramics | Lo, CL; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-Jul-2002 | Low-voltage cathodoluminescence properties of the Y2O2S : Eu red light emitting phosphor screen in field-emission environments | Lo, CL; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 23-Jul-2001 | Luminescent mechanisms of ZnS : Cu : Cl and ZnS : Cu : Al phosphors | Chen, YY; Duh, JG; Chiou, BS; Peng, CG; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-Dec-2003 | Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package | Huang, CS; Duh, JG; Chen, YM; 材料科學與工程學系; Department of Materials Science and Engineering |
| 3-Oct-2002 | Microstructure characteristics for anorthite composite glass with nucleating agents of TiO2 under non-isothermal crystallization | Lo, CL; Duh, JG; Chiou, BS; Lee, WH; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 15-Aug-2001 | Synthesis of Eu3+-activated yttrium oxysulfide red phosphor by flux fusion method | Lo, CL; Duh, JG; Chiou, BS; Peng, CC; Ozawa, L; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-Dec-1995 | Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrate | Chiou, BS; Chang, JH; Duh, JG; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-Nov-2000 | Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints | Miao, HW; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-May-2001 | Wettability of electroless Ni in the under bump metallurgy with lead free solder | Young, BL; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-Jan-2006 | Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder | Lin, YC; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
