瀏覽 的方式： 作者 Fan, Chia-Wen
顯示 1 到 1 筆資料，總共 1 筆
| 公開日期 | 標題 | 作者 |
| 1-一月-2014 | Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60 mu m-pitch Solder Micro Bump Interconnections | Huang, Yu-Wei; Zhan, Chau-Jie; Juang, Jing-Ye; Lin Yu-Min; Huang, Shin-Yi; Chen, Su-Mei; Fan, Chia-Wen; Cheng, Ren-Shin; Chao, Shu-Han; Hsieh, Wan-Lin; Chen, Chih; Lau, John H.; 材料科學與工程學系; Department of Materials Science and Engineering |
