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Browsing by Author Feng, Shien-Ping
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Showing results 1 to 1 of 1
Issue Date
Title
Author(s)
1-Mar-2014
Effect of polyimide baking on bump resistance in flip-chip solder joints
Cheng, Hsi-Kuei
;
Feng, Shien-Ping
;
Lai, Yi-Jen
;
Liu, Kuo-Chio
;
Wang, Ying-Lang
;
Liu, Tzeng-Feng
;
Chen, Chih-Ming
;
材料科學與工程學系
;
照明與能源光電研究所
;
Department of Materials Science and Engineering
;
Institute of Lighting and Energy Photonics
