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Browsing by Author Gusak, A. M.

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Issue DateTitleAuthor(s)
1-Apr-2020Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder jointsGusak, A. M.; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
21-Aug-2019A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy productionTu, K. N.; Gusak, A. M.; 國際半導體學院; International College of Semiconductor Technology
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