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Browsing by Author Helfen, Lukas

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Issue DateTitleAuthor(s)
20-Dec-2017Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void FormationChang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2016Study of Discrete Voids Formation in Flip-Chip Solder Joints due to Electromigration Using In-Situ 3D Laminography and Finite-Element ModelingChang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering
15-Sep-2016Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modelingChang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 1 to 3 of 3