Browsing by Author Hsiao, H. Y.
Showing results 1 to 4 of 4
| Issue Date | Title | Author(s) |
| 1-May-2012 | The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering | Huang, Y. S.; Hsiao, H. Y.; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Oct-2010 | Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints | Liang, S. W.; Hsiao, H. Y.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-十月-2010 | Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints | Liang, S. W.; Hsiao, H. Y.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-四月-2007 | Temperature dependent responsivity of quantum dot infrared photodetectors | Wang, S. Y.; Lo, M. C.; Hsiao, H. Y.; Ling, H. S.; Lee, C. P.; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
