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1-五月-2012The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state solderingHuang, Y. S.; Hsiao, H. Y.; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2010Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder JointsLiang, S. W.; Hsiao, H. Y.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2010Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder JointsLiang, S. W.; Hsiao, H. Y.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Apr-2007Temperature dependent responsivity of quantum dot infrared photodetectorsWang, S. Y.; Lo, M. C.; Hsiao, H. Y.; Ling, H. S.; Lee, C. P.; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
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