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Browsing by Author Hsieh, Wan-Lin

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Issue DateTitleAuthor(s)
2015Bump Resistance Change Behavior due to Cu-Sn IMCs Formation with Various Solder DiametersHsieh, Wan-Lin; Lin, Chung-Kuang; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 交大名義發表; 材料科學與工程學系; National Chiao Tung University; Department of Materials Science and Engineering
1-Jan-2014Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60 mu m-pitch Solder Micro Bump InterconnectionsHuang, Yu-Wei; Zhan, Chau-Jie; Juang, Jing-Ye; Lin Yu-Min; Huang, Shin-Yi; Chen, Su-Mei; Fan, Chia-Wen; Cheng, Ren-Shin; Chao, Shu-Han; Hsieh, Wan-Lin; Chen, Chih; Lau, John H.; 材料科學與工程學系; Department of Materials Science and Engineering
2017杏壇中不能說的秘密－國小女同性戀教師生命故事之敘說研究謝婉琳; 許鶯珠; Hsieh, Wan-Lin; Hsu, Ying-Chu; 教育研究所
Showing results 1 to 3 of 3