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Browsing by Author Huang, YM
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Showing results 1 to 4 of 4
Issue Date
Title
Author(s)
1-Dec-2004
Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow
Shao, TL
;
Chen, TS
;
Huang, YM
;
Chen, C
;
材料科學與工程學系
;
Department of Materials Science and Engineering
29-Jun-2006
Interfacial reaction and shear strength of Pb-free SnAg2.5Cu0.86b0.5 and SnAg3.0Cu0.5Sb0.2 solder bumps on Au/Ni(P) metallization
Hsu, YC
;
Huang, YM
;
Chen, C
;
Wang, H
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1-Oct-2002
Mechanisms linking employee affective delivery and customer behavioral intentions
Tsai, WC
;
Huang, YM
;
經營管理研究所
;
Institute of Business and Management
1-Apr-2006
Multiple-objective planning for a production and distribution model of the supply chain: Case of a bicycle manufacturer
Tzeng, GH
;
Tang, TI
;
Huang, YM
;
Chang, ML
;
科技管理研究所
;
Institute of Management of Technology