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Browsing by Author Huang, Yu-wei

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Issue DateTitleAuthor(s)
2015Bump Resistance Change Behavior due to Cu-Sn IMCs Formation with Various Solder DiametersHsieh, Wan-Lin; Lin, Chung-Kuang; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 交大名義發表; 材料科學與工程學系; National Chiao Tung University; Department of Materials Science and Engineering
2014Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigrationLin, Wan-Hsuan; Chao, Shu-Han; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 電機學院; College of Electrical and Computer Engineering
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