瀏覽 的方式： 作者 Huang, Yu-wei
顯示 1 到 2 筆資料，總共 2 筆
| 公開日期 | 標題 | 作者 |
| 2015 | Bump Resistance Change Behavior due to Cu-Sn IMCs Formation with Various Solder Diameters | Hsieh, Wan-Lin; Lin, Chung-Kuang; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 交大名義發表; 材料科學與工程學系; National Chiao Tung University; Department of Materials Science and Engineering |
| 2014 | Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigration | Lin, Wan-Hsuan; Chao, Shu-Han; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 電機學院; College of Electrical and Computer Engineering |
