Browsing by Author Huang, Yu-wei
Showing results 1 to 2 of 2
| Issue Date | Title | Author(s) |
| 2015 | Bump Resistance Change Behavior due to Cu-Sn IMCs Formation with Various Solder Diameters | Hsieh, Wan-Lin; Lin, Chung-Kuang; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 交大名義發表; 材料科學與工程學系; National Chiao Tung University; Department of Materials Science and Engineering |
| 2014 | Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigration | Lin, Wan-Hsuan; Chao, Shu-Han; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 電機學院; College of Electrical and Computer Engineering |
