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Browsing by Author Hung, Chi-Cheng

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Showing results 1 to 7 of 7
Issue DateTitleAuthor(s)
1-Nov-2016Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaningWei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-Nov-2016Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaningWei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-Jan-2008Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishingHung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang; 交大名義發表; National Chiao Tung University
5-Mar-2017Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materialsSu, Yin-Hsien; Kuo, Tai-Chen; Lee, Wen-Hsi; Wang, Yu-Sheng; Hung, Chi-Cheng; Tseng, Wei-Hsiang; Wei, Kuo-Hsiu; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-Jul-2010Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing SlurryLee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-Jan-2016A Study on the Plating and Wetting Ability of Ruthenium-Tungsten Multi-layers for Advanced Cu MetallizationKuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
16-Aug-2016A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallizationKuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang; 光電工程學系; Department of Photonics
Showing results 1 to 7 of 7