Browsing by Author Hwang, Yu-Jiau
Showing results 1 to 1 of 1
| Issue Date | Title | Author(s) |
| 1-Jun-2012 | A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application | Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
