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Browsing by Author Jeng, JH
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Showing results 1 to 3 of 3
Issue Date
Title
Author(s)
1-Jun-2001
Application of A1/PI composite bumps to COG bonding process
Jeng, JH
;
Hsieh, TE
;
材料科學與工程學系
;
Department of Materials Science and Engineering
1998
An efficient architecture of ultrasonic scan conversion for implementing the cubic convolution interpolation
Chang, DC
;
Wu, WR
;
Jeng, JH
;
電信工程研究所
;
Institute of Communications Engineering
1-Jan-2005
An empirical approach toward realistic modeling of capital market volatility
Wang, NJ
;
Wang, KL
;
Jeng, JH
;
交大名義發表
;
National Chiao Tung University
