Browsing by Author Juang, Jing Ye
Showing results 1 to 3 of 3
| Issue Date | Title | Author(s) |
| 1-Jan-2018 | Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper | Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-一月-2019 | Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper | Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-一月-2019 | Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copper | Juang, Jing Ye; Shie, Kai Cheng; Hsu, Po-Ning; Li, Yu Jin; Tu, K. N.; Chen, Chin; 材料科學與工程學系; Department of Materials Science and Engineering |
