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Browsing by Author Kuo, Shu-Chiao

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Showing results 1 to 4 of 4
Issue DateTitleAuthor(s)
1-Jan-2017Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous IntegrationYang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Electrical Testing Structure for Stacking Error Measurement in 3D IntegrationLee, Shih-Wei; Kuo, Shu-Chiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Feb-2018A Novel Method of Electrical Measurement for Stacking Error in 3D/2.5D IntegrationLee, Shih-Wei; Kuo, Shu-Chiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015三維積體電路之低溫銅與銅接合結構設計及可靠度研究郭書喬; Kuo, Shu-Chiao; 陳冠能; 電子工程學系 電子研究所
Showing results 1 to 4 of 4