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Browsing by Author Lai, Ming-Fang

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Issue DateTitleAuthor(s)
2007Fast flip-chip pin-out designation respin by pin-block design and floorplanning for package-board codesignLee, Ren-Jie; Lai, Ming-Fang; Chen, Hung-Ming; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2008An implementation of performance-driven block and I/O placement for chip-package codesignLai, Ming-Fang; Chen, Hung-Ming; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Nov-2011Wafer-level three-dimensional integrated circuits (3D IC): Schemes and key technologiesLai, Ming-Fang; Li, Shih-Wei; Shih, Jian-Yu; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
Showing results 1 to 3 of 3