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Browsing by Author Lan, J. K.
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Issue Date
Title
Author(s)
2008
Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates
Lin, C. K.
;
Chen, Chih
;
Yu, H. M.
;
Lan, J. K.
;
Lee, D. L.
;
材料科學與工程學系
;
Department of Materials Science and Engineering