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Browsing by Author Lee, Alvin

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Issue DateTitleAuthor(s)
1-Jan-2017Process Development and Material Characteristics of TSV-less Interconnection Technology for FOWLPShen, Wen-Wei; Lin, Yu-Min; Chang, Hsiang-Hung; Kuo, Tzu-Ying; Fu, Huan-Chun; Lee, Yuan-Chang; Lee, Shu-Man; Lin, Ang-Ying; Huang, Shin-Yi; Chang, Tao-Chih; Lee, Alvin; Su, Jay; Huang, Baron; Bai, Dongshun; Liu, Xiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015Ultrathin Glass Wafer Lamination and Laser Debonding to Enable Glass Interposer FabricationShen, Wen-Wei; Chang, Hsiang-Hung; Wang, Jen-Chun; Ko, Cheng-Ta; Tsai, Leon; Wang, Bor Kai; Shorey, Aric; Lee, Alvin; Su, Jay; Bai, Dongshun; Huang, Baron; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
Showing results 1 to 2 of 2