| 公開日期 | 標題 | 作者 |
| 三月-2017 | Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-nm Photolysis Polymer System for High-Throughput 3-D IC Applications | Cheng, Chuan-An; Tsai, Tsung-Yen; Huang, Yu-Hsiang; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-三月-2014 | Enhancing device efficiencies of solid-state near-infrared light-emitting electrochemical cells by employing a tandem device structure | Lee, Chia-Lin; Cheng, Chia-Yu; Su, Hai-Ching; 照明與能源光電研究所; Institute of Lighting and Energy Photonics |
| 1-三月-2017 | Feasibility Investigation of Amorphous Silicon as Release Layer in Temporary Bonding for 3-D Integration and FOWLP Scheme | Cheng, Chuan-An; Huang, Yu-Hsiang; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-一月-2015 | The impacts of green claims on coffee consumers\' purchase intention | Chen, Mei-Fang; Lee, Chia-Lin; 經營管理研究所; Institute of Business and Management |
| 1-一月-2016 | The Influence of Device Morphology on Wafer-Level Bonding with Polymer-Coated Layer | Liang, Hao-Wen; Chen, Hsiu-Chi; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 2010 | PLASMONIC-ENHANCED POLYMER PHOTOVOLTAIC DEVICES INCORPORATING AU NANOPARTICLES | Wu, Jyh-Lih; Lee, Chia-Lin; Chen, Fang-Chung; Kuo, Chun-Hong; Huang, Michael H.; 光電工程學系; Department of Photonics |
| 2016 | Study of a Novel Amorphous Silicon Temporary Bonding and Corresponding Laser Assisted De-bonding Technology | Huang, Yu-Hsiang; Liang, Hao-Wen; Cheng, Chuan-An; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 2015 | An Ultra-Fast Temporary Bonding and Release Process Based on Thin Photolysis Polymer in 3D Integration | Tsai, Tsung-Yen; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電機工程學系; Department of Electrical and Computer Engineering |
| 2016 | Wafer-Level MOSFET with Submicron Photolysis Polymer Temporary Bonding Technology Using Ultra-Fast Laser Ablation for 3DIC Application | Cheng, Chuan-An; Huang, Yu-Hsiang; Lin, Chicn-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 2013 | 以堆疊串聯式結構提升固態近紅外光有機電化學元件效率 | 李佳陵; Lee, Chia-Lin; 蘇海清; Su, Hai-Ching; 照明與能源光電研究所 |
| 2010 | 廣告訊息要素與環保價格折扣對綠色品牌權益及購買意願的影響──綠色信任的調節作用 | 李佳璘; Lee, Chia-Lin; 陳美芳; Chen, Mei-Fang; 經營管理研究所 |
