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Browsing by Author Lee, Shu-Man

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Issue DateTitleAuthor(s)
1-Jan-2017Process Development and Material Characteristics of TSV-less Interconnection Technology for FOWLPShen, Wen-Wei; Lin, Yu-Min; Chang, Hsiang-Hung; Kuo, Tzu-Ying; Fu, Huan-Chun; Lee, Yuan-Chang; Lee, Shu-Man; Lin, Ang-Ying; Huang, Shin-Yi; Chang, Tao-Chih; Lee, Alvin; Su, Jay; Huang, Baron; Bai, Dongshun; Liu, Xiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2018An RDL-First Fan-out Wafer-level Package for Heterogeneous Integration ApplicationsLin, Yu-Min; Wu, Sheng-Tsai; Shen, Wen-Wei; Huang, Shin-Yi; Kuo, Tzu-Ying; Lin, Ang-Ying; Chang, Tao-Chih; Chang, Hsiang-Hung; Lee, Shu-Man; Lee, Chia-Hsin; Su, Jay; Liu, Xiao; Wu, Qi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
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