Browsing by Author Li, Yu-Jin
Showing results 1 to 8 of 8
| Issue Date | Title | Author(s) |
| 1-Dec-2018 | Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu | Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2016 | Growth of Cu6Sn5 and Cu3Sn Intermetallic compounds on (111)-, (100)-, and randomly-oriented copper films. | Li, Yu-Jin; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Jan-2019 | High Electromigration Lifetimes of Nanotwinned Cu Redistribution Lines | Tseng, I-Hsin; Li, Yu-Jin; Lin, Benson; Chang, Chia-Cheng; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Jan-2019 | High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging | Li, Yu-Jin; Hsu, Wei-Yu; Lin, Benson; Chang, ChiaCheng; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Jan-2019 | Highly (111)-oriented Nanotwinned Cu for High Fatigue Resistance in fan-out wafer-level packaging | Li, Yu-Jin; Theng, Chih-Han; Tseng, I-Hsin; Chen, Chih; Lin, Benson; Chang, Chia-Cheng; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2017 | MOOC平台內之使用者自編系統設計 | 李昱瑾; 黎漢林; Li, Yu-Jin; Li, Han-Lin; 資訊管理研究所 |
| 1-Mar-2020 | Tensile Properties and Thermal Stability of Unidirectionally < 111 >-Oriented Nanotwinned and < 110 >-Oriented Microtwinned Copper | Li, Yu-Jin; Tu, King-Ning; Chen, Chih; 材料科學與工程學系; 國際半導體學院; Department of Materials Science and Engineering; International College of Semiconductor Technology |
| 2-Mar-2020 | Tensile Properties of < 111 >-Oriented Nanotwinned Cu with Different Columnar Grain Structures | Li, Yu-Jin; Tu, King-Ning; Chen, Chih; 材料科學與工程學系; 國際半導體學院; Department of Materials Science and Engineering; International College of Semiconductor Technology |
