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Showing results 1 to 8 of 8
Issue DateTitleAuthor(s)
1-Dec-2018Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned CuJuang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2016Growth of Cu6Sn5 and Cu3Sn Intermetallic compounds on (111)-, (100)-, and randomly-oriented copper films.Li, Yu-Jin; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2019High Electromigration Lifetimes of Nanotwinned Cu Redistribution LinesTseng, I-Hsin; Li, Yu-Jin; Lin, Benson; Chang, Chia-Cheng; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2019High-toughness (111) nano-twinned copper lines for fan-out wafer-level packagingLi, Yu-Jin; Hsu, Wei-Yu; Lin, Benson; Chang, ChiaCheng; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2019Highly (111)-oriented Nanotwinned Cu for High Fatigue Resistance in fan-out wafer-level packagingLi, Yu-Jin; Theng, Chih-Han; Tseng, I-Hsin; Chen, Chih; Lin, Benson; Chang, Chia-Cheng; 材料科學與工程學系; Department of Materials Science and Engineering
2017MOOC平台內之使用者自編系統設計李昱瑾; 黎漢林; Li, Yu-Jin; Li, Han-Lin; 資訊管理研究所
1-Mar-2020Tensile Properties and Thermal Stability of Unidirectionally < 111 >-Oriented Nanotwinned and < 110 >-Oriented Microtwinned CopperLi, Yu-Jin; Tu, King-Ning; Chen, Chih; 材料科學與工程學系; 國際半導體學院; Department of Materials Science and Engineering; International College of Semiconductor Technology
2-Mar-2020Tensile Properties of < 111 >-Oriented Nanotwinned Cu with Different Columnar Grain StructuresLi, Yu-Jin; Tu, King-Ning; Chen, Chih; 材料科學與工程學系; 國際半導體學院; Department of Materials Science and Engineering; International College of Semiconductor Technology
Showing results 1 to 8 of 8