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Browsing by Author Liang, Hao-Wen

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Showing results 1 to 4 of 4
Issue DateTitleAuthor(s)
2016Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique for 3D IntegrationLiang, Hao-Wen; Yu, Ting-Yang; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2016The Influence of Device Morphology on Wafer-Level Bonding with Polymer-Coated LayerLiang, Hao-Wen; Chen, Hsiu-Chi; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Study of a Novel Amorphous Silicon Temporary Bonding and Corresponding Laser Assisted De-bonding TechnologyHuang, Yu-Hsiang; Liang, Hao-Wen; Cheng, Chuan-An; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016三維積體電路之暫時性接合其高分子形貌分析與超薄緩衝層應用於非對稱低溫接合結構梁皓雯; 陳冠能; Liang, Hao-Wen; Chen, Kuan-Neng; 電子工程學系 電子研究所
Showing results 1 to 4 of 4