| Issue Date | Title | Author(s) |
| 1-May-2010 | Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration | Liang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Aug-2008 | Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy | Hsiao, Hsiang-Yao; Liang, S. W.; Ku, Min-Feng; Chen, Chih; Yao, Da-Jeng; 材料科學與工程學系; Department of Materials Science and Engineering |
| 19-Feb-2007 | Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints | Liang, S. W.; Chiu, S. H.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Oct-2010 | Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints | Liang, S. W.; Hsiao, H. Y.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Oct-2010 | Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints | Liang, S. W.; Hsiao, H. Y.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-May-2009 | Effect of bump size on current density and temperature distributions in flip-chip solder joints | Kuan, Wei-Chih; Liang, S. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Jul-2008 | Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration | Liang, S. W.; Chang, Y. W.; Chen, Chih; Preciado, Jackie; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2009 | Effect of Passivation Opening Design on Electromigration Reliability Issue in Flip-Chip Solder Joints | Chen, Tzu Yu; Liang, S. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 10-Jul-2006 | Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration | Liang, S. W.; Chang, Y. W.; Shao, T. L.; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2007 | Effects of current crowding and Joule heating on reliability of solder joints | Liang, S. W.; Chiu, S. H.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Sep-2012 | Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish | Chu, Ming-Hui; Liang, S. W.; Chen, Chih; Huang, Annie T.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Mar-2007 | Electromigration issues in lead-free solder joints | Chen, Chih; Liang, S. W.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Aug-2006 | Geometrical effect of bump resistance for flip-clip solder joints: Finite-element modeling and experimental results | Liang, S. W.; Chang, Y. W.; Chen, Chih; Liu, Y. C.; Chen, K. H.; Lin, S. H.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2006 | Joule heating effect under accelerated electromigration in flip-chip solder joints | Chiu, S. H.; Liang, S. W.; Chen, Chili; Yao, D. J.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Dec-2009 | Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints | Liang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2009 | Optima Design of Contact Opening for Relieving Current Crowding Effect in Flip-Chip Solder Joints | Liang, S. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Oct-2007 | Relieving hot-spot temperature during electromigration in solder and current crowding effects bumps by using Cu columns | Liang, S. W.; Chang, Y. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 17-Jul-2006 | Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes | Chang, Y. W.; Liang, S. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Feb-2007 | Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testing | Liang, S. W.; Chang, Y. W.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
