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Browsing by Author Liang, Yu-Chun

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Issue DateTitleAuthor(s)
2013Generic Rules to Achieve Bump Electromigration Immortality for 3D IC IntegrationChen, Hsiao-Yun; Shih, Da-Yuan; Wei, Cheng-Chang; Tung, Chih-Hang; Hsiao, Yi-Li; Yu, Douglas Cheng-Hua; Liang, Yu-Chun; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
12-Apr-2018A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumpsChang, Yuan-Wei; Hu, Chia-chia; Peng, Hsin-Ying; Liang, Yu-Chun; Chen, Chih; Chang, Tao-chih; Zhan, Chau-Jie; Juang, Jing-Ye; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 1 to 2 of 2