瀏覽 的方式： 作者 Lin, Benson
顯示 1 到 4 筆資料，總共 4 筆
| 公開日期 | 標題 | 作者 |
| 1-一月-2018 | Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper | Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-一月-2019 | High Electromigration Lifetimes of Nanotwinned Cu Redistribution Lines | Tseng, I-Hsin; Li, Yu-Jin; Lin, Benson; Chang, Chia-Cheng; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-一月-2019 | High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging | Li, Yu-Jin; Hsu, Wei-Yu; Lin, Benson; Chang, ChiaCheng; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-一月-2019 | Highly (111)-oriented Nanotwinned Cu for High Fatigue Resistance in fan-out wafer-level packaging | Li, Yu-Jin; Theng, Chih-Han; Tseng, I-Hsin; Chen, Chih; Lin, Benson; Chang, Chia-Cheng; 材料科學與工程學系; Department of Materials Science and Engineering |
