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Browsing by Author Liu, Tao-Chi

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Showing results 1 to 9 of 9
Issue DateTitleAuthor(s)
2013Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State AgingLiu, Tao-Chi; Huang, Yi-Sa; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2013Eliminate Kirkendall voids in solder reactions on nanotwinned copperLiu, Tao-Chi; Liu, Chien-Min; Huang, Yi-Sa; Chen, Chih; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2014Extremely anisotropic single-crystal growth in nanotwinned copperLu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2012Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc ElectrodepositionLiu, Tao-Chi; Liu, Chien-Min; Hsiao, Hsiang-Yao; Lu, Jia-Ling; Huang, Yi-Sa; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2015Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packagingChiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
1-Oct-2011Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devicesLiu, Tao-Chi; Chen, Chih; Liu, Shih-Ting; Chang, Ming-Lun; Lin, Jandel; 材料科學與工程學系; Department of Materials Science and Engineering
1-Dec-2012Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beamLiu, Tao-Chi; Chen, Chih; Chiu, Kuo-Jung; Lin, Han-Wen; Kuo, Jui-Chao; 材料科學與工程學系; Department of Materials Science and Engineering
25-May-2012Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned CopperHsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
2012以直流電製備奈米雙晶銅及其在3D IC 封裝之應用劉道奇; Liu, Tao-Chi; 陳智; Chen, Chih; 材料科學與工程學系
Showing results 1 to 9 of 9