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Showing results 1 to 8 of 8
Issue DateTitleAuthor(s)
1-Nov-2001Characterization and reliability of low dielectric constant fluorosilicate glass and silicon rich oxide process for deep sub-micron device applicationCheng, YL; Wang, YL; Liu, CW; Wu, YL; Lo, KY; Liu, CP; Lan, JK; 材料科學與工程學系; Department of Materials Science and Engineering
30-Jan-2004Copper surface protection with a completely enclosed copper structure for a damascene processWang, TC; Hsieh, TE; Wang, YL; Wu, YL; Lo, KY; Liu, CW; Chen, KW; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2004Effect of deposition temperature, on thermal stability in high-density plasma chemical vapor deposition fluorine-doped silicon dioxideCheng, YL; Wang, YL; Chen, HW; Lan, JL; Liu, CP; Wu, SA; Wu, YL; Lo, KY; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
30-Jan-2004Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnectChen, KW; Wang, YL; Liu, CP; Yang, K; Chang, L; Lo, KY; Liu, CW; 材料科學與工程學系; Department of Materials Science and Engineering
15-Jan-2004Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallizationCheng, YL; Wang, YL; Liu, CP; Wu, YL; Lo, KY; Liu, CW; Lan, JK; Ay, C; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-Nov-2001Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic processLan, JK; Wang, YL; Lo, KY; Liu, CP; Liu, CW; Wang, JK; Cheng, YL; Chau, CG; 材料科學與工程學系; Department of Materials Science and Engineering
2001Novel strategies of FSG-CMP for within-wafer uniformity improvement and wafer edge yield enhancement beyond 0.18 micro technologiesChen, KW; Wang, YL; Chang, L; Liu, CW; Lin, YK; Wang, TC; Chang, ST; Lo, KY; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jul-2004Optimization of post-N-2 treatment and undoped-Si-glass cap to improve metal wring delamination in deep submicron high-density plasma-fluorinated silica glass intermetal dielectric applicationCheng, YL; Wang, YL; Lan, JK; Wu, SA; Chang, SC; Lo, KY; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 1 to 8 of 8