瀏覽 的方式： 作者 Peng, Hsin-Ying
顯示 1 到 2 筆資料，總共 2 筆
| 公開日期 | 標題 | 作者 |
| 12-四月-2018 | A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps | Chang, Yuan-Wei; Hu, Chia-chia; Peng, Hsin-Ying; Liang, Yu-Chun; Chen, Chih; Chang, Tao-chih; Zhan, Chau-Jie; Juang, Jing-Ye; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2009 | Shape Effect of Passivation Opening on the Electric Behavior in Flip-chip SnAg Solder Joints under Electromigration | Peng, Hsin-Ying; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
