瀏覽 的方式： 作者 Scheel, Mario
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| 公開日期 | 標題 | 作者 |
| 20-十二月-2017 | Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation | Chang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering |
