| 公開日期 | 標題 | 作者 |
| 2005 | 3-D simulation on current density distribution in flip-cbip solder joints with thick CuUBM under current stressing | Liang, SW; Shao, TL; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-十二月-2004 | Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow | Shao, TL; Chen, TS; Huang, YM; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2004 | Electromigration failure mechanism of Sn96.5Ag3.5 flip-chip solder bumps | Shao, TL; Chen, IH; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering |
| 15-十月-2004 | Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization pads | Shao, TL; Chen, YH; Chiu, SH; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2002 | Electromigration induced failure in SnAg3.8Cu0.7 solder joints for flip chip technology | Hsu, YC; Shao, TL; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-十一月-2003 | Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization | Shao, TL; Lin, KC; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-十一月-2003 | Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization | Hsu, YC; Shao, TL; Yang, CJ; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering |
| 9-一月-2006 | Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration | Chiu, SH; Shao, TL; Chen, C; Yao, DJ; Hsu, CY; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-九月-2005 | Microstructural evolution during electromigration in eutectic SnAg solder bumps | Chen, YH; Shao, TL; Liu, PC; Chen, C; Chou, T; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-八月-2004 | Microstructure evolution during electromigration in eutectic SnPb solder bumps | Lu, CM; Shao, TL; Yang, CJ; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-一月-2006 | Relieving the current crowding effect in flip-chip solder joints during current stressing | Liang, SW; Shao, TL; Chen, C; Yeh, ECC; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-十一月-2004 | Thermal gradient in solder joints under electrical-current stressing | Shao, TL; Chiu, SH; Chen, C; Yao, DJ; Hsu, CY; 材料科學與工程學系; Department of Materials Science and Engineering |
