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Browsing by Author Shih, FY
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Showing results 1 to 4 of 4
Issue Date
Title
Author(s)
1-Nov-1999
Effectively blocking copper diffusion at low-k hydrogen silsesquioxane/copper interface
Liu, PT
;
Chang, TC
;
Yang, YL
;
Cheng, YF
;
Shih, FY
;
Lee, JK
;
Tsai, E
;
Sze, SM
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-Aug-1999
Effects of hydrogen on electrical and chemical properties of low-k hydrogen silsesquioxane as an intermetal dielectric for nonetchback processes
Chang, TC
;
Liu, PT
;
Shih, FY
;
Sze, SM
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
2000
High-performance integration of copper interconnects with low-k hydrogen silsesquioxane employing deuterium plasma treatment
Liu, PT
;
Chang, TC
;
Yang, YL
;
Cheng, YF
;
Lee, JK
;
Shih, FY
;
Tsai, E
;
Chen, G
;
Sze, SM
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-Mar-2000
Improvement on intrinsic electrical properties of low-k hydrogen silsesquioxane/copper interconnects employing deuterium plasma treatment
Liu, PT
;
Chang, TC
;
Yang, YL
;
Cheng, YF
;
Lee, JK
;
Shih, FY
;
Tsai, E
;
Chen, G
;
Sze, SM
;
材料科學與工程學系
;
電子工程學系及電子研究所
;
Department of Materials Science and Engineering
;
Department of Electronics Engineering and Institute of Electronics