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Showing results 1 to 14 of 14
Issue DateTitleAuthor(s)
1-Sep-2014Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration ApplicationsShih, Jian-Yu; Huang, Wen-Chun; Ko, Cheng-Ta; Yang, Zheng; Hu, Sheng-Hsiang; Leu, Jihperng; Chou, Keng C.; Chen, Kuan-Neng; 交大名義發表; 材料科學與工程學系; 電子工程學系及電子研究所; National Chiao Tung University; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
Jul-2016Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer DielectricHuang, Yen-Jun; Hsieh, Yen-Hui; Shih, Jian-Yu; Chen, Han-Chun; Leu, Jihperng; Chen, Kuan-Neng; 材料科學與工程學系; 電子物理學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
2014Advanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding StructureShih, Jian-Yu; Chen, Yen-Chi; Lee, Shih-Wei; Hu, Yu-Chen; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Aug-2013Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme With Hermetic SealingShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-2015Device Characteristics of TSV-Based Piezoelectric Resonator With Load Capacitance and Static Capacitance ModificationShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Feb-2018Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer InterfaceHsieh, Yen-Hui; Huang, Yen-Jun; Shih, Jian-Yu; Leu, Jihperng; Chen, Kuan-Neng; 材料科學與工程學系; 電子物理學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
1-Aug-2014Motional Resistance Issue of TSV-Based Resonator Device and Its Improvement With a Concave Cu TSV Structural DesignShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Chen, Kuan-Neng; 交大名義發表; 電子工程學系及電子研究所; National Chiao Tung University; Department of Electronics Engineering and Institute of Electronics
1-Jan-2014A Novel Si-based X'tal Oscillator Device Using 3D Integration TechnologiesShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2014Polymer TSV Fabrication Scheme with Its Electrical and Reliability Test VehicleLee, Shih-Wei; Shih, Jian-Yu; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2017Polymer-Based Liner TSV Fabrication Scheme and Its Resistance VariationLee, Shih-Wei; Shih, Jian-Yu; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Oct-2014Quartz resonator assembling with TSV interposer using polymer sealing or metal bondingShih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013TSV-Based Quartz Crystal Resonator Using 3D Integration and Si Packaging TechnologiesShih, Jian-Yu; Chen, Yen-Chi; Chiang, Cheng-Hao; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Nov-2011Wafer-level three-dimensional integrated circuits (3D IC): Schemes and key technologiesLai, Ming-Fang; Li, Shih-Wei; Shih, Jian-Yu; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015三維積體電路之頻率振盪元件封裝特性與應用施建宇; Shih, Jian-Yu; 陳冠能; Chen, Kuan-Neng; 電子工程學系 電子研究所
Showing results 1 to 14 of 14