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National Chiao Tung University Institutional Repository
Browsing by Author Tsao, W. A.
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Showing results 1 to 1 of 1
Issue Date
Title
Author(s)
15-Feb-2012
Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints
Liang, Y. C.
;
Tsao, W. A.
;
Chen, Chih
;
Yao, Da-Jeng
;
Huang, Annie T.
;
Lai, Yi-Shao
;
材料科學與工程學系
;
Department of Materials Science and Engineering
