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Issue DateTitleAuthor(s)
-Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
-Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-Oct-1997Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-Oct-1997Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-1997Chemical-mechanical polishing and material characteristics of plasma-enhanced chemically vapor deposited fluorinated oxide thin filmsTseng, WT; Hsieh, YT; Lin, CF; Tsai, MS; Feng, MS; 材料科學與工程學系; 奈米中心; Department of Materials Science and Engineering; Nano Facility Center
31-Oct-1997Chemical-mechanical polishing of low-dielectric-constant spin-on-glasses: film chemistries, slurry formulation and polish selectivityWang, YL; Liu, C; Chang, ST; Tsai, MS; Feng, MS; Tseng, WT; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Feb-1997CMP of fluorinated silicon dioxide: Is it necessary and feasible?Tseng, WT; Hsieh, YT; Lin, CF; 交大名義發表; National Chiao Tung University
1-May-1999A comparative study on the roles of velocity in the material removal rate during chemical mechanical polishingTseng, WT; Chin, JH; Kang, LC; 機械工程學系; Department of Mechanical Engineering
31-Oct-1997Effects of corrosion environments on the surface finishing of copper chemical mechanical polishingWang, MT; Tsai, MS; Liu, C; Tseng, WT; Chang, TC; Chen, LJ; Cheng, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Nov-1999Effects of film stress on the chemical mechanical polishing processTseng, WT; Wang, YH; Chin, JH; 機械工程學系; Department of Mechanical Engineering
15-Dec-1996Effects of mechanical characteristics on the chemical-mechanical polishing of dielectric thin filmsTseng, WT; Liu, CW; Dai, BT; Yeh, CF; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-1998The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detectionWang, YL; Liu, C; Feng, MS; Tseng, WT; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-1998The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detectionWang, YL; Liu, C; Feng, MS; Tseng, WT; 材料科學與工程學系; Department of Materials Science and Engineering
1-Sep-1997Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvementWang, YL; Tseng, WT; Feng, MS; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Sep-1997Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvementWang, YL; Tseng, WT; Feng, MS; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Feb-1996Modeling of the wear mechanism during chemical-mechanical polishingLiu, CW; Dai, BT; Tseng, WT; Yeh, CF; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1997Modified double-layer PECVD passivation films for improving nonvolatile memory IC performanceLin, CF; Tseng, WT; Feng, MS; Chang, YF; 交大名義發表; 材料科學與工程學系; National Chiao Tung University; Department of Materials Science and Engineering
2-Nov-1998A modified multi-chemical spray cleaning process for post shallow trench isolation chemical mechanical polishing cleaning applicationWang, YL; Wang, TC; Wu, J; Tseng, WT; Lin, CF; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-1998A modified multi-chemicals spray cleaning process for post-CMP cleaning applicationWang, YL; Liu, C; Feng, MS; Tseng, WT; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Jan-1998A modified multi-chemicals spray cleaning process for post-CMP cleaning applicationWang, YL; Liu, C; Feng, MS; Tseng, WT; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
Showing results 1 to 20 of 28  next >