| 公開日期 | 標題 | 作者 |
| 25-九月-2004 | The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thiourea | Kao, YL; Tu, GC; Huang, CA; Chang, JH; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-四月-2004 | Characteristics of the rough-cut surface of quenched and tempered martensitic stainless steel using wire electrical discharge machining | Huang, CA; Tu, GC; Yao, HT; Kuo, HH; 交大名義發表; National Chiao Tung University |
| 1-一月-2006 | CoSix thermal stability on narrow-width polysilicon resistors | Chen, YM; Tu, GC; Wang, YL; Hwang, GJ; Lo, CY; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-二月-2006 | The effect of 180 degrees C-annealing on the electrochemical behavior of nano-thick zinc-electroplated copper in aqueous solutions with different pH | Kao, YL; Tu, GC; Huang, CA; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-五月-2001 | Effect of catalyst on growth behavior of carbon nanotube synthesizing by microwave heating thermal chemical vapor deposition process | Chen, SC; Shih, LY; Chang, YC; Tu, GC; Lin, IN; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-九月-1997 | The effect of indium impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usage | Lin, W; Tu, GC; Lin, CF; Peng, YM; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-六月-1996 | The effect of lead impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usage | Lin, W; Tu, GC; Lin, CF; Peng, YM; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-六月-1996 | The effect of lead impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usage | Lin, W; Tu, GC; Lin, CF; Peng, YM; 材料科學與工程學系; Department of Materials Science and Engineering |
| 30-十月-2003 | The electrochemical behavior of tin-doped indium oxide during reduction in 0.3 M hydrochloric acid | Huang, CA; Li, KC; Tu, GC; Wang, WS; 材料科學與工程學系; Department of Materials Science and Engineering |
| 21-十二月-2005 | The electrochemical polishing behavior of porous austenitic stainless steel (AISI 316L) in phosphoric-sulfuric mixed acids | Chen, SC; Tu, GC; Huang, CA; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2001 | Fabrication and characterization of Cu-SiCp composites for electrical discharge machining applications | Shu, KM; Tu, GC; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-四月-1996 | Fabrication and microstructure of the dc-magnetron-sputtered YBa2Cu3O7-x superconducting thin films | Koo, HS; Tseng, TY; Chang, WR; Tu, GC; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics |
| 1-八月-2000 | Hard chromium plating on cold swaged Cr-Mo steel using rotating cylinder electrode | Huang, CA; Tu, GC; Liao, MC; Kao, YL; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2005 | Microstructural study of the effect of chloride ion on electroplating of copper in cupric sulfate-sulfuric acid bath | Kao, YL; Li, KC; Tu, GC; Huang, CA; 材料科學與工程學系; Department of Materials Science and Engineering |
| 25-五月-2003 | The microstructure and the thermal expansion characteristics of Cu/SiCp composites | Shu, KM; Tu, GC; 材料科學與工程學系; Department of Materials Science and Engineering |
| 9-六月-2004 | Nanomechanical properties of nanocrystalline Ni-Fe mold insert | Yeh, YM; Tu, GC; Fang, TH; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-三月-2006 | Oxide-mediated fort-nation of epitaxy silicide on heavily doped Si surfaces and narrow width active region | Chen, YM; Tu, GC; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-四月-2005 | Reverse CoSi(2) thermal stability and digitized sheet resistance increase of sub-90 nm polysilicon lines | Lo, CY; Peng, YC; Chen, YM; Tu, GC; Lin, SS; Chen, WM; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-十一月-2004 | Simulation analysis and experimental verification of LIGA-like process for Ni-Fe micromold insert with taper angle | Fu, MN; Yeh, YM; Tu, GC; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-十月-2003 | Simulation analysis and experimental verification of UV-LIGA process for high-aspect-ratio Ni-Fe micro-mold insert | Yeh, YM; Tu, GC; Fu, MN; 材料科學與工程學系; Department of Materials Science and Engineering |
