瀏覽 的方式： 作者 Tu, KN
顯示 1 到 4 筆資料，總共 4 筆
| 公開日期 | 標題 | 作者 |
| 1-八月-2005 | Electromigration in pb-free SnAg3.8Cu0.7 solder stripes | Hsu, YC; Chou, CK; Liu, PC; Chen, C; Yao, DJ; Chou, T; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering |
| 10-十二月-2001 | Enhanced dopant activation and elimination of end-of-range defects in BF2+-implanted silicon-on-insulator by high-density current | Lin, HH; Cheng, SL; Chen, LJ; Chen, C; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-一月-2006 | Relieving the current crowding effect in flip-chip solder joints during current stressing | Liang, SW; Shao, TL; Chen, C; Yeh, ECC; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering |
| 16-五月-2005 | Threshold current density of electromigration in eutectic SnPb solder | Yeh, YT; Chou, CK; Hsu, YC; Chen, C; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering |
