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Showing results 1 to 4 of 4
Issue DateTitleAuthor(s)
1-Aug-2005Electromigration in pb-free SnAg3.8Cu0.7 solder stripesHsu, YC; Chou, CK; Liu, PC; Chen, C; Yao, DJ; Chou, T; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering
10-Dec-2001Enhanced dopant activation and elimination of end-of-range defects in BF2+-implanted silicon-on-insulator by high-density currentLin, HH; Cheng, SL; Chen, LJ; Chen, C; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2006Relieving the current crowding effect in flip-chip solder joints during current stressingLiang, SW; Shao, TL; Chen, C; Yeh, ECC; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering
16-May-2005Threshold current density of electromigration in eutectic SnPb solderYeh, YT; Chou, CK; Hsu, YC; Chen, C; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 1 to 4 of 4