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Issue DateTitleAuthor(s)
1-May-2005Aplication of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnectionChiu, SY; Wang, YL; Chang, SC; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
15-Nov-2003The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layerChiu, SY; Wang, YL; Liu, CP; Lan, JK; Ay, C; Feng, MS; Tsai, MS; Dai, BT; 材料科學與工程學系; Department of Materials Science and Engineering
1-Nov-2001Characterization and reliability of low dielectric constant fluorosilicate glass and silicon rich oxide process for deep sub-micron device applicationCheng, YL; Wang, YL; Liu, CW; Wu, YL; Lo, KY; Liu, CP; Lan, JK; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2006Characterization and thermal stability of fluorosilicate glass films deposited by high density plasma chemical vapor deposition with different bias powerHsiao, WC; Liu, CP; Wang, YL; Cheng, YL; 材料科學與工程學系; Department of Materials Science and Engineering
31-Oct-1997Chemical-mechanical polishing of low-dielectric-constant spin-on-glasses: film chemistries, slurry formulation and polish selectivityWang, YL; Liu, C; Chang, ST; Tsai, MS; Feng, MS; Tseng, WT; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-Mar-2006Comparison of characteristics and integration of copper diffusion-barrier dielectricsWang, TC; Cheng, YL; Wang, YL; Hsieh, TE; Hwang, GJ; Chen, CF; 材料科學與工程學系; Department of Materials Science and Engineering
30-Jan-2004Copper surface protection with a completely enclosed copper structure for a damascene processWang, TC; Hsieh, TE; Wang, YL; Wu, YL; Lo, KY; Liu, CW; Chen, KW; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2006CoSix thermal stability on narrow-width polysilicon resistorsChen, YM; Tu, GC; Wang, YL; Hwang, GJ; Lo, CY; 材料科學與工程學系; Department of Materials Science and Engineering
1-Sep-2004Direct COSi2 thin-film formation with homogeneous nanograin-size distribution by oxide-mediated silicidationChang, JJ; Liu, CP; Chen, SW; Chang, CC; Hsieh, TE; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering
24-Feb-2006Effect of deposition temperature and oxygen flow rate on properties of low dielectric constant SiCOH film prepared by plasma enhanced chemical vapor deposition using diethoxymethylsilaneCheng, YL; Wang, YL; Hwang, GJ; O'Neill, ML; Karwacki, EJ; Liu, PT; Chen, CF; 材料科學與工程學系; 光電工程學系; Department of Materials Science and Engineering; Department of Photonics
1-May-2004Effect of deposition temperature, on thermal stability in high-density plasma chemical vapor deposition fluorine-doped silicon dioxideCheng, YL; Wang, YL; Chen, HW; Lan, JL; Liu, CP; Wu, SA; Wu, YL; Lo, KY; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jul-2003Effect of substrate on the step coverage of plasma-enhanced chemical-vapor deposited tetraethylorthosilicate filmsLan, JK; Wang, YL; Chao, CG; Lo, K; Cheng, YL; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2006Effects of plasma treatment in the tungsten process for chemical vapor deposition titanium nitride barrier film beyond nanometer technologyChen, KW; Wang, YL; Chang, L; Li, FY; Hwang, GJ; 材料科學與工程學系; Department of Materials Science and Engineering
31-Oct-1997Effects of underlying films on the chemical-mechanical polishing for shallow trench isolation technologyWang, YL; Liu, C; Feng, MS; Dun, JW; Chou, KS; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
30-Jan-2004Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnectChen, KW; Wang, YL; Liu, CP; Yang, K; Chang, L; Lo, KY; Liu, CW; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-1998The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detectionWang, YL; Liu, C; Feng, MS; Tseng, WT; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-1998The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detectionWang, YL; Liu, C; Feng, MS; Tseng, WT; 材料科學與工程學系; Department of Materials Science and Engineering
1-Apr-2005Formation of pyramid-like nanostructures during cobalt film growth by magnetron sputteringLiu, CP; Chang, JJ; Chen, SW; Chung, HC; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering
24-Feb-2006Heat, moisture and chemical resistance on low dielectric constant (low-k) film using diethoxymethylsilane (DEMS) prepared by plasma enhanced chemical vapor depositionCheng, YL; Wang, YL; Lan, JK; Hwang, GJ; O'Neil, ML; Chen, CF; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2006High-selectivity damascene chemical mechanical polishingChiu, SY; Wang, YL; Liu, CP; Chang, SC; Hwang, GJ; Feng, MS; Chen, CF; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 1 to 20 of 53  next >