1. You are Here：

Browsing by Author Yang, Yi-Lun

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:  
Showing results 1 to 3 of 3
Issue DateTitleAuthor(s)
1-Jan-2020Adhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer/Metal Hybrid BondingLu, Cheng-Hsien; Yang, Yi-Lun; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jun-2020Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3-D IntegrationYang, Yi-Lun; Ito, Hiroyuki; Kim, Young Suk; Ohba, Takayuki; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
1-Jan-2019Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion EvaluationYang, Yi-Lun; Liu, Jia-Ling; Chen, Guan Wei; Kodama, Shoichi; Kobinata, Kyosuke; Chen, Kuan-Neng; Ito, Hiroyuki; Kim, Young Suk; Ohba, Takayuki; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
Showing results 1 to 3 of 3