瀏覽 的方式： 作者 Yao, D. J.
顯示 1 到 5 筆資料，總共 5 筆
| 公開日期 | 標題 | 作者 |
| 1-九月-2006 | Effect of al trace dimension on electromigration failure time of flip-chip solder joints | Chiu, S. H.; Chen, Chih; Yao, D. J.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 16-May-2011 | Effect of Si-die dimensions on electromigration failure time of flip-chip solder joints | Chang, Y. W.; Chiu, S. H.; Chen, Chih; Yao, D. J.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2009 | INVESTIGATION OF JOULE HEATING EFFECT IN VARIOUS STAGES OF FAILURE IN FLIP-CHIP SOLDER JOINTS UNDER ACCELERATED ELECTROMIGRATION | Hsiao, Hsiang Yao; Chen, Chih; Yao, D. J.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 2006 | Joule heating effect under accelerated electromigration in flip-chip solder joints | Chiu, S. H.; Liang, S. W.; Chen, Chili; Yao, D. J.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Jul-2011 | Successful recovery of human viable spermatozoa with curve-straight channel microfluidic system device | Huang, H.; Yao, D. J.; Huang, H. J.; Li, J. R.; Fan, S. K.; Wang, M. L.; Yung-Kuei, S.; 材料科學與工程學系; Department of Materials Science and Engineering |
